The earthquake that occurred off northeastern Japan and the resulting tsunamis have impacted and touched millions of people around the world. Our thoughts convey to all the people who have been affected.

Manufacturing and Delivery Process
Currently, manufacturing process of some of our products has been delayed due to assembly supply issues.
We are making our own effort to keep our standard delivery period for our valued customers. However, the schedule and general situation have been varied time to time and you are kindly requested to contact our local agent or us so that we could inform you actual situation properly.
Thank you for your understanding.

2011. Nov. 9-11 th LSI Testing Symposium
Place: Osaka Senri Life Science Building
We exhibit Panels and all catalogues of our Product Line-up.

*PL101 Laser Opener –By Panel Exhibiting and completed sample showing.
This system is effective for Cu wire IC also.
We have the sufficient know-how to expose the Die & Wires without damage based on our long term experience for Failure Analysis.

*PS103S-This is the New Model of Plastic Mold Decapsulation System by Acid
It can make the good collaboration with the PL101 for the Best result.

*All other Catalogue and completed sample showing
PS102W/S-Acid Decap system, ES301/372/401-Reactive Ion Etching System
BA101-Backside Micro Shiner, FB101/102/200-Automatic Curve Tracer
PE101-Mechanical Milling system, ES312-Dry Decapper

We are waiting your visit at our booth during the term.

7-9th Dec.2011 Semicon Japan
Place: Makuhari Messe
Booth No: 8D-801

*PL101 Laser Opener –By the actual machine and completed sample showing.
This system is effective for Cu wire IC very much.
We have the sufficient know-how to expose the Die & Wires without damage based on our long term experience for Failure Analysis.

*PL121 Laser Opener- New Product- higher power/wide stage version

*PS103S-Wet Decap System By Actual machine. New Product
This is the New Model of Plastic Mold Decapsulation System by Acid. It can make the good collaboration with the PL101/121,too.

* PS102W-actual machine-Auto-mixed function attached.

*ES372-Reactive Ion Etching System-Etching for passivation or any any Inter-layer film.

*ED lab- Sample Decap/Etching by this Lab with charge

*All other Catalogue and completed sample showing
PS102W/S-Acid Decap system, ES301/372/401-Reactive Ion Etching System
BA101-Backside Micro Shiner, FB101/102/200-Automatic Curve Tracer
PE101-Mechanical Milling system, ES312-Dry Decapper

We are expecting your visit at our booth during the term.